General Informations
TF 600 GS PG01_3: Surface Mount Fuse, 10.1 x 3.22 mm, Time-Lag T, Telecom
Description
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This product is phased-out without alternate Type. Availability upon request. |
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Directly solderable on printed circuit boards |
Standards
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IEC 60127-4 |
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UL 248-14 |
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CSA C22.2 no. 248.14 |
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Telcordia GR-1089 |
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UL 60950 / IEC 60950 |
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ITU-T K.20 and K.21 |
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TIA-968-A |
Approvals
| Rated Voltage |
600 VAC, 125 VDC |
| Rated Current |
0.5 - 2 A |
| Breaking Capacity |
60 A |
| Characteristic |
Time-Lag T |
| Mounting |
PCB,SMT |
| Admissible Ambient Air Temp. |
-55 °C to 125 °C |
| Climatic Category |
55/125/21 acc. to IEC 60068-1 |
| Material: Housing |
Ceramic |
| Material: Terminals |
Tin-Plated Copper Alloy |
| Unit Weight |
0.23 g |
| Storage Conditions |
0 °C to 60 °C, max. 70% r.h. |
| Product Marking |
 , Type, Current, Characteristic |
| Soldering Methods |
Reflow |
| Solderability |
245 °C / 3 sec acc. to IEC 60068-2-58, Test Td |
| Resistance to Soldering Heat |
260 °C / 10 sec acc. to IEC 60068-2-58, Test Td |
| Flammability |
min. UL 94V-1
(acc. to EIA/IS-722, Test 4.12) |
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Soldering pads
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Rated Current In |
1.0 x Inmin. |
2.5 x Inmin. |
2.5 x Inmax |
| 0.5 A - 2 A |
4 h |
1 s |
120 s |
| Time in Seconds |
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Current in Amperes
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Mounting |
Rated Voltage [VAC] |
Voltage Drop 1.0 In typ. [mV] |
Cold Resistance typ. [mΩ] |
Melting I²t 10.0 In typ. [A²s] |
Order Number |
eStore |
Schurter Stock- Check |
Distrib. Stock- Check |
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| PCB |
600 |
107 |
210 |
1.14 |
2000.0010.xx |
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| PCB |
600 |
94 |
73.2 |
21.4 |
2000.0011.xx |
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| PCB |
600 |
55 |
27.8 |
22.3 |
2000.0012.xx |
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| 1) 60 A @ 600 VAC / 60 A @ 125 VDC |
|
.xx = .11 |
Plastic Bag (100 pcs.) |
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.xx = .24 |
Blister Tape 33 cm Reel (2000 pcs.) |
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