Schurter logo
Open menuClose menu
SearchSearchSearchSearch
What are you looking for?

Soldering Profile

On this page

SCHURTER components for printed circuit boards are suitable for common solder processes. THT components can be wave soldered with a peak temperature of 230 to 260°C. SMD components are suitable for reflow soldering with a peak temperature of 260°C.

Please note the soldering specification on the product data sheet.

Recommended Wave Soldering Profile

The solder temperature 230°C – 260°C depends on the solder classification of the components.

Recomended Reflow Soldering Profile


Soldering Profile:

Reflow feature

Pb-free assembly

Preheat

Min. 150°C

Preheat

Max. 200°C

Preheat

Time (Min. - Max.) 60-120 secs

Ramp-up rate (TL to Tp)

3°C / secs max.

Liquidous temperature (TL)

217°C

Time (tL) maintained above (TL)

60 - 150 secs

Time (tP) below 5°C of max. peak temperature

30 secs max.

Ramp-down rate (TP to TL)

6°C / secs max.

Time 25°C to peak temperature

8 mins max.

Peak temperature maximum

260°C

* The peak temperature depends also on the component volume (see JEDEC J-STD-020D)

Scroll to top